IA_03_cabecera
Start / End
June 2020 / March 2023
Code
PR-01326

The ANDANTE project (AI for New Devices And Technologies at the Edge) aims to leverage innovative hardware platforms to build robust hardware/software platforms for Artificial Neural Networks (ANNs) and Spiking Neural Networks (SNNs) as the foundation for future products in the Internet of Things (IoT) at the edge, combining high energy efficiency with strong neuromorphic computing capabilities, demonstrating these in key application areas. The project brings together the expertise and infrastructures of Imec, CEA, and FhG, along with semiconductor companies, system integrators, AI SMEs, and application experts to explore and demonstrate the capabilities provided by the developed technologies.

The project will evaluate various applications in key areas where Europe is strong (automotive, digital agriculture, digital industry, mobility, and digital life). The goal is to strengthen and maintain strong leadership in these areas by connecting the industry with future memory technologies at a low TRL level (MRAM, OXRAM, FeFET). These interdisciplinary efforts will lead to the development of innovative hardware/software Deep Learning solutions, based on high-TRL RRAM/PCM and FeFET, to enable future products that combine high energy efficiency with robust cognitive computing capabilities. This new type of computing technology, combining ANN and SNN capabilities, will open up new possibilities, such as environmental monitoring and wearable electronic devices.

Within the ANDANTE project, Gradiant will participate in the use case of robust autonomous landing for smart mobility and transportation, providing video analysis-based algorithms for object detection and aerial image capture. Gradiant will also work on the optimization of these algorithms for FPGAs, as well as their evaluation on FPGAs and, optionally, on the neuromorphic hardware resulting from the project. Additionally, Gradiant will take on the role of Dissemination Manager.

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Financing
H2020
Consortium
STMICROELECTRONICS GRENOBLE 2 SAS, COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, STMICROELECTRONICS CROLLES 2 SAS, INSTITUT POLYTECHNIQUE DE BORDEAUX, THALES SA, ALSEAMAR, INTERUNIVERSITAIR MICROELECTRONICA CENTRUM, INFINEON TECHNOLOGIES AG, VALEO SCHALTER UND SENSOREN GMBH, FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V ., EESY-INNOVATION GMBH, FRIEDRICH-ALEXANDERUNIVERSITAET ERLANGEN NUERNBERG, TECHNISCHE UNIVERSITAET DRESDEN, HEIMANN SENSOR GMBH, FERROELECTRIC MEMORY GMBH, PHILIPS MEDICAL SYSTEMS NEDERLAND BV, PHILIPS ELECTRONICS NEDERLAND BV, STICHTING IMEC NEDERLAND, GRAI MATTER LABS BV, INOV INESC INOVACAO - INSTITUTO DE NOVAS TECNOLOGIAS, CENTRO DE COMPETENCIAS PARA O TOMATE INDUSTRIA ASSOCIACAO PARA A INVESTIGACAO DESENVOLVIMENTO E INOVACAO NO SETOR, ITALAGRO INDUSTRIA DE TRANSFORMACAODE PRODUTOS ALIMENTARES SA, TPRO - TECHNOLOGIES LDA, AICTX AG, CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA - RECHERCHE ET DEVELOPPEMENT, UNIVERSITAT ZURICH, BOEING RESEARCH & TECHNOLOGY EUROPE S.L.U., TELEVES SA, CARTOGALICIA SL
This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No.876925  

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