The project “Fostering the semiconductor value chain in Spain through research on components for a 3D system based on SWIR imaging” aims to investigate new technologies in the design, processing, testing and packaging of semiconductor components for a 3D system based on SWIR imaging. It also seeks to develop a wafer-scale manufacturing process for broadband image sensors based on quantum dots (CQD), which will provide fast responses at the nanosecond scale.
Gradiant’s role within the project is to develop artificial intelligence-based systems for the industrial inspection of photonic semiconductors, using machine learning and computer vision algorithms to efficiently and accurately detect defects and assess semiconductor quality.
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